IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

D-356B: Bare Substrate Electrical Test Data Format

IPC-D-350D: Printed Board Description in Digital Form

IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

IPC-9199: Statistical Process Control (SPC) Quality Rating

IPC-2252: Design Guide for RF/Microwave Circuit Boards

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-1753: Laboratory Report Standard

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

J-STD-030A: Selection and Application of Board Level Underfill Materials

1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-A-610F: Acceptability of Electronic Assemblies

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies