11 Products

Member: $0.00

Nonmember: $0.00

IPC-A-610DC-Telecom Addendum

Member: $0.00

Nonmember: $0.00

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

Member: $0.00

Nonmember: $0.00

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

Member: $0.00

Nonmember: $0.00

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $67.00

Nonmember: $135.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

Member: $47.00

Nonmember: $93.00

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

Member: $47.00

Nonmember: $93.00

IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

Member: $65.00

Nonmember: $131.00

IPC-D-350D: Printed Board Description in Digital Form

Member: $84.00

Nonmember: $168.00

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

Member: $84.00

Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

Member: $47.00

Nonmember: $93.00

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices