IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC-J-STD-075-Spanish: Clasificación de componentes electrónicos no-IC para procesos de ensamble

IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

IPC-A-600G-SW: Acceptability of Printed Boards

IPC-6012B-SW: Qualification and Performance Specification for Rigid Printed Boards

A-600GPL(D)1: Acceptability of Printed Boards

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

A-610DJP(D)1: Acceptability of Electronic Assemblies

J-STD-005-JP: Requirements for Soldering Pastes - Includes Amendment 1

J-STD-004A-JP: Requirements for Soldering Fluxes

J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-600G-JP/EK: Acceptability of Printed Boards

IPC-7711/21B-HU: Elektronikai szerelvények újramunkálása, módosítása és javítása

IPC-7711/21B-CZ: Přepracování, modifikace a opravy elektronických sestav