98 Products

Member: $84.00

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J-STD-004B-CN: 修订本 1 助焊剂要求

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Nonmember: $131.00

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $47.00

Nonmember: $93.00

IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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Nonmember: $246.00

IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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Nonmember: $246.00

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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Nonmember: $135.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

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IPC-D-355: Printed Board Automated Assembly Description in Digital Form

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IPC-D-325A: Documentation Requirements for Printed Boards

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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download

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IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

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IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-9641: High Temperature Printed Board Flatness Guideline