64 Products

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

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D-356B: Bare Substrate Electrical Test Data Format

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-7526: Stencil and Misprinted Board Cleaning Handbook

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat