IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

J-STD-003C WAM1: Solderability Tests for Printed Boards

IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-A-610F-RO: Acceptabilitatea Ansamblurilor Electronice

IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter

IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

IPC-A-610F-FR: Acceptabilité des assemblages électroniques

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

IPC-A-610F: Acceptability of Electronic Assemblies

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들

IPC-A-610F-KR: 전자 어셈블리에 대한 허용 가능성

J-STD-001F-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

IPC-A-610F-PL: Dopuszczalność Zespołów Elektronicznych