38 Products

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-7527: 焊膏印刷要求 - Chinese

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IPC-2220-FAM: Design Standards for Printed Boards

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A-620B-IL: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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J-STD-005A-CN: 焊膏要求

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC-2221B-DE: Basisrichtlinie für das Design von Leiterplatten

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IPC/WHMA-A-620B-DE: Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

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IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

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2221A: Generic Standard on Printed Board Design

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IPC/WHMA-A-620B-CN: 线缆及线束组件的要求与验收

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TM-650-MDP: Method Development Packet

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1758: Declaration Requirements for Shipping, Pack and Packing Materials