JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

IPC-CI-408: Design & Application Guidelines for the Use of Solderless Surface Mount Connectors

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4761: Design Guide for Protection of Printed Board Via Structures

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

2221A: Generic Standard on Printed Board Design