56 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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IPC-6012DS-CN: 刚性印制板的鉴定及性能规范航天和军事航空电子应用补充标准

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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IPC-D-355: Printed Board Automated Assembly Description in Digital Form

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IPC-D-325A: Documentation Requirements for Printed Boards

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IPC-CA-821: General Requirements for Thermally Conductive Adhesives - Single User Download

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IPC-9501: PWB Assembly Process Simulation for Evaluation of Electronic Components

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IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

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2221A: Generic Standard on Printed Board Design