IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles

IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC/WHMA-A-620 Test Data Tables

IPC/WHMA-A-620B-Redline

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

IPC/JEDEC J-STD-609A Errata Information

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A-610DC-Telecom Addendum

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-7527: 焊膏印刷要求 - Chinese

IPC-2220-FAM: Design Standards for Printed Boards

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

IPC-A-610E-EE: Elektroonikakoostude vastavusnõuded

A-620B-EE: Juhtme- ja kaablikoostude vastavusnõuded