109 Products

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IPC-7527: Requirements for Solder Paste Printing

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IPC-7527: 焊膏印刷要求 - Chinese

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A-JP: ソルダペーストに関する要求事項

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J-STD-005A-JP: ソルダペーストに関する要求事項

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J-STD-005A-CN: 焊膏要求

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J-STD-005A: Requirements for Soldering Pastes

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J-STD-005A: Requirements for Soldering Pastes

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC-AJ-820A: 组装和连接手册

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IPC/WHMA-A-620 Test Data Tables

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

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T-50H-CN: 电子电路互连与封装术语及定义

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610DC-Telecom Addendum