IPC-4761: Design Guide for Protection of Printed Board Via Structures
15 Products
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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices
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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline
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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
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IPC-HDBK-005: Guide to Solder Paste Assessment
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IPC-2615: Printed Board Dimensions and Tolerances
Member: $0.00 Nonmember: $0.00
IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile
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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards
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IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films
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IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
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IPC-6011: Generic Performance Specification for Printed Boards
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IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives
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IPC-A-311: Process Controls for Phototool Generation and Use