IPC-4556: 印制板化学镍/钯/浸金（ENEPIG）规范

IPC/WHMA-A-620 Test Data Tables

IPC/WHMA-A-620B-Redline

IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

IPC/JEDEC J-STD-609A Errata Information

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-7527: 焊膏印刷要求 - Chinese

IPC-2220-FAM: Design Standards for Printed Boards

IPC-7095C-CN: BGA设计与组装工艺的实施

IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

J-STD-005A-CN: 焊膏要求

J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-A-311: Process Controls for Phototool Generation and Use

IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

IPC-6011: Generic Performance Specification for Printed Boards

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films

IPC-3406: Guidelines for Electrically Conductive Surface Mount Adhesives

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology