IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

IPC-A-610E-CN: 电子组件的可接受性

J-STD-001E-CN: Rev E superseded by Rev F

IPC-1601-CN: 印制板操作和贮存指南

IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC-D-279: Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

IPC-A-610D WAM1: Acceptability of Electronic Assemblies

IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

IPC-A-311: Process Controls for Phototool Generation and Use

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

IPC-8497-1: Cleaning Methods and Contamination Assessment for Optical Assembly

IPC-6011: Generic Performance Specification for Printed Boards

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4761: Design Guide for Protection of Printed Board Via Structures

IPC-3408: General Requirements for Anisotropically Conductive Adhesives Films