47 Products

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IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-SP: Aceptabilidad de Ensambles Electrónicos

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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies