87 Products

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-7527: 焊膏印刷要求 - Chinese

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IPC-2220-FAM: Design Standards for Printed Boards

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IPC-7095C-CN: BGA设计与组装工艺的实施

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J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

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IPC-A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准

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J-STD-005A-CN: 焊膏要求

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-SM-817A-CN: 表面贴装用绝缘粘合剂通用规范

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings