75 Products

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC/WHMA-A-620AS WAM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC-7527: Requirements for Solder Paste Printing

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-2291: Design Guideline for Printed Electronics

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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IPC-1752A WAM1&2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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J-STD-005A: Requirements for Soldering Pastes

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IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-003C WAM1: Solderability Tests for Printed Boards

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-2221B: Generic Standard on Printed Board Design