55 Products

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-2220-FAM: Design Standards for Printed Boards

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IPC/WHMA-A-620B-VN: Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây và Bộ Cáp...

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IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies