46 Products

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Nonmember: $168.00

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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Nonmember: $158.00

IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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IPC-2231: DFX Guidelines

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IPC-2231: DFX Guidelines

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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IPC-2591: Connected Factory Exchange (CFX)

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IPC-2591: Connected Factory Exchange (CFX)

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IPC-9111: Troubleshooting for Printed Board Assembly Processes

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IPC-9111:Troubleshooting for Printed Board Assembly Processes

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IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2