IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1
IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards
IPC-A-610D WAM1: Acceptability of Electronic Assemblies
IPC-8497-1: Cleaning Methods and Contamination Assessment for Optical Assembly
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices