46 Products

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-CM-770E: Component Mounting Guidelines for Printed Boards

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

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IPC-1720A: Assembly Qualification Profile

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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives