40 Products

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline

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IPC/WHMA-A-620AS-AM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC/JEDEC J-STD-609A Errata Information

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Nonmember: $638.00

IPC-2220-FAM: Design Standards for Printed Boards

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-7526: Stencil and Misprinted Board Cleaning Handbook

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

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IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

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TM-650-MDP: Method Development Packet

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1758: Declaration Requirements for Shipping, Pack and Packing Materials

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IPC-AJ-820A: Assembly & Joining Handbook