8 Products

Member: $47.00

Nonmember: $93.00

IPC-7530: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

Member: $47.00

Nonmember: $93.00

IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

Member: $47.00

Nonmember: $93.00

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

Member: $47.00

Nonmember: $93.00

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

Member: $47.00

Nonmember: $93.00

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

Member: $65.00

Nonmember: $131.00

IPC-2615: Printed Board Dimensions and Tolerances

Member: $65.00

Nonmember: $131.00

IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

Member: $0.00

Nonmember: $0.00

IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile