IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

J-STD-004B-CN: 修订本 1 助焊剂要求

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

2221A: Generic Standard on Printed Board Design

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices