J-STD-004B-CN: 修订本 1 助焊剂要求
21 Products
IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項
T-50H-CN: 电子电路互连与封装术语及定义
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610DC-Telecom Addendum
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit
IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards
2221A: Generic Standard on Printed Board Design
IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat
IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards
IPC-2225: Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies
IPC-6015: Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures