89 Products

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IPC-1072-AM1: Intellectual Property Protection in Electronic Assembly Manufacturing

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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-A610G: Acceptatie van geassembleerde printplaten

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IPC-A-610G: Acceptatie van geassembleerde printplaten

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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten

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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten

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IPC-A-610G: Elektroonikakoostude vastavusnõuded

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IPC-A-610G: Elektroonikakoostude vastavusnõuded

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IPC-A-620C-NL: Eisen en acceptatie van kabel en draadboom assemblage

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IPC/WHMA-A-620C: Eisen en acceptatie van kabel en draadboom assemblages

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-J-STD-001G: Nõuded joodetud elektri- ja elektroonikakoostudele

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IPC-J-STD-001G: Nõuded joodetud elektri- ja elektroonikakoostudele

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility