IPC-9850A: Surface Mount Placement Equipment Characterization
84 Products
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IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范
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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes
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IPC-7525B-CN: 模板设计指导
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IPC-7525B-DE: Designrichtlinie für Druckschablonen
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IPC-7525B: Stencil Design Guidelines
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IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
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IPC-T-50J: SUPERSEDED BY T-50K
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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects
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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products
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IPC-CH-65B-CN: 印制板及组件清洗指南
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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies
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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施
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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components
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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范
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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides
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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards
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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards
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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...
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A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles