IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

IPC-CM-770E: Component Mounting Guidelines for Printed Boards

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4761: Design Guide for Protection of Printed Board Via Structures

IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

IPC-1720A: Assembly Qualification Profile

IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-1753: Laboratory Report Standard

9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications