63 Products

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IPC-J-STD-001G-AM1: Provee requisitos para materiales de soldadura y procesos para ensambles

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610F-IL: קבלה של הרכבות אלקטרוניות

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IPC-A-610E-IL: Acceptability of Electronic Assemblies

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IPC-A-610E-SP: Aceptabilidad de Ensambles Electrónicos

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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados

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IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components