IPC/WHMA-A-620B-S: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B

IPC/WHMA-A-620B-AM1: Requirements and Acceptance for Cable and Wire Harness Assemblies

IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-HDBK-005: Guide to Solder Paste Assessment

IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4761: Design Guide for Protection of Printed Board Via Structures

IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

IPC-HDBK-830A: Guidelines for Design, Selection, and Application of Conformal Coatings

IPC-A-630: Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures

IPC-1753: Laboratory Report Standard

IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

IPC-9641: High Temperature Printed Board Flatness Guideline

J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

IPC-2291: Design Guideline for Printed Electronics