IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium
IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...
IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
A-600GPL(D)1: Acceptability of Printed Boards
IPC/WHMA-A-620A-PL: Rev A superseded by Rev B
IPC-A-600G-CH: Acceptability of Printed Boards
J-STD-004B-CN: 修订本 1 助焊剂要求
J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...
IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components
IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)
IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability
IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components