78 Products

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten

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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC/JEDEC-J-STD-035: Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

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IPC-9502: PWB Assembly Soldering Process Guideline for Electronic Components

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-A-610F: Acceptability of Electronic Assemblies

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology