IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

IPC-A-610DC-Telecom Addendum

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies

A-600GPL(D)1: Acceptability of Printed Boards

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

9702-CN: 板极互连的单向弯曲特性描述

J-STD-004B-CN: 修订本 1 助焊剂要求

IPC-1720A-CN: 组装资格认证纲要

J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

T-50H-CN: 电子电路互连与封装术语及定义

IPC-A-600G-IT/EK: Acceptability of Printed Boards

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

IPC-D-326A: Information Requirements for Manufacturing Printed Circuit Boards and Other Electronic Assemblies

D-356B: Bare Substrate Electrical Test Data Format

IPC-CM-770E: Component Mounting Guidelines for Printed Boards

IPC-9199: Statistical Process Control (SPC) Quality Rating

IPC-9194: Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

IPC-7912A: End-Item DPMO for Printed Circuit Board Assemblies

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

IPC-2615: Printed Board Dimensions and Tolerances

IPC-2252: Design Guide for RF/Microwave Circuit Boards