J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés
65 Products
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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques
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J-STD-001F-AM1-RO: Cerințe pentru Ansamblurile Electrice și Electronice Lipite
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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1
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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing
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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
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IPC-1072: Intellectual Property Protection in Electronic Assembly Manufacturing
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IPC-HDBK-4691: Handbook on Adhesive Bonding in Electronic Assembly Operations
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IPC-A-610F-SE: Acceptanskrav för kretskort
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IPC-4103 WAM1 - AM2: Amendment 2 to Specification for Base Materials for High Speed/High Frequency...
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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1
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IPC-6903: Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
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IPC-6903: Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级
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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试
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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级
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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
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IPC-6012D-Redline: Qualification and Performance Specification for Rigid Printed Boards-Red Line
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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...
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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards
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IPC-6012DS: Dodatek do Aplikacji Kosmicznych i Awioniki Wojskowej dla dokumentu IPC-6012D - Specyfikacji Zdolności i...