IPC-6012D-AM1: リジッドプリント板の認定および性能仕様-改定1
66 Products
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IPC-6012D: リジッドプリント板の認定および性能仕様
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IPC-6012D: リジッドプリント板の認定および性能仕様
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IPC-6012D-AM1: Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu
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IPC-6012D: Sert Baskı Devre Kartları İçin Kalifikasyon ve Performans Spesifikasyonu
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IPC-J-STD-001G: Требования к электрическим и электронным сборкам, изготавливаемым с помощью пайки
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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア
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IPC-7711/21C: 電子組立品のリワーク、改造およびリペア
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IPC-J-STD-001G: はんだ付される電気及び電⼦組立品に関する要件事項
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J-STD-001G: はんだ付される電気及び電⼦組立品に関する要件事項
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IPC-A-610G: 電子組立品の許容基準
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IPC-A-610G: 電子組立品の許容基準
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English
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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline
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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English
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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards
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IPC-A-610G: Acceptability of Electronic Assemblies
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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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IPC-7091: Design and Assembly Process Implementation of 3D Components