IPC-A-610E-RL: Acceptability of Electronic Assemblies

IPC-A600H-Errata: IPC-A-600H Errata Information

IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

IPC-A-610E-KR: 전자 어셈블리의 허용 가능성

IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

IPC-A-610E-CN: 电子组件的可接受性

J-STD-001E-CN: Rev E superseded by Rev F

IPC-1601-CN: 印制板操作和贮存指南

IPC-A-610E-FR: Acceptabilité des assemblages électroniques

IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

IPC-A-610DFR: Acceptability of Electronic Assemblies

J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles

IPC-HDBK-610: Handbook and Guide to Supplement IPC-A-610 (Includes IPC-A-610 B-C-D Comparisons) with Amendment 1

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

IPC-A-610D WAM1: Acceptability of Electronic Assemblies

IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

IPC-8497-1: Cleaning Methods and Contamination Assessment for Optical Assembly

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement