12 Products

Member: $47.00

Nonmember: $93.00

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

Member: $47.00

Nonmember: $93.00

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

Member: $84.00

Nonmember: $168.00

IPC-HDBK-005: Guide to Solder Paste Assessment

Member: $47.00

Nonmember: $93.00

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

Member: $47.00

Nonmember: $93.00

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

Member: $47.00

Nonmember: $93.00

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

Member: $47.00

Nonmember: $93.00

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

Member: $65.00

Nonmember: $131.00

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Member: $84.00

Nonmember: $168.00

IPC-4761: Design Guide for Protection of Printed Board Via Structures

Member: $47.00

Nonmember: $93.00

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

Member: $65.00

Nonmember: $131.00

IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

Member: $40.00

Nonmember: $74.00

2221A: Generic Standard on Printed Board Design