16 Products

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IPC-A-610DC-Telecom Addendum

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Nonmember: $0.00

IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $123.00

Nonmember: $246.00

A-600GPL(D)1: Acceptability of Printed Boards

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Nonmember: $246.00

IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

Member: $246.00

Nonmember: $490.00

IPC-7711/21A-PL:Rework and Repair Guide

Member: $47.00

Nonmember: $93.00

IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations

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Nonmember: $93.00

IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing

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Nonmember: $93.00

IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

Member: $65.00

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IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

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2221A: Generic Standard on Printed Board Design

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Nonmember: $168.00

IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

Member: $47.00

Nonmember: $93.00

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices