IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...
IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations
IPC-8413-1: Specification for Process Carriers Used to Handle Optical Fibers in Manufacturing
IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards
IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit
2221A: Generic Standard on Printed Board Design
IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-9241: Guidelines for Microsection Preparation
J-STD-609B: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free)...
J-STD-046: Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers
IPC-1782: Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring
IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...
IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...
IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-1601A: Printed Board Handling and Storage Guidelines
IPC-A-600J: Acceptability of Printed Boards
1071B: Intellectual Property Protection in Printed Board Manufacturing
IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards
IPC-A-610F-WAM1: Acceptability of Electronic Assemblies
J-STD-001F-WAM1: J-STD-001 Revision F with Amendment 1: Requirements for Soldered Electrical and Electronic Assemblies