30 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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IPC-HDBK-005: Guide to Solder Paste Assessment

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-7526: Stencil and Misprinted Board Cleaning Handbook

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IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

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IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

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IPC-9201A: Surface Insulation Resistance Handbook

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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IPC-5702: Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

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IPC-7711/21B: Rework, Modification and Repair of Electronic Assemblies