36 Products

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-7525B-CN: 模板设计指导

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IPC-7525B-DE: Designrichtlinie für Druckschablonen

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IPC-7525B: Stencil Design Guidelines

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IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

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IPC-T-50J: SUPERSEDED BY T-50K

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

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IPC-CH-65B-CN: 印制板及组件清洗指南

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IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

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T-50H-CN: 电子电路互连与封装术语及定义

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-7711/21B-SW: Rework, Modification and Repair of Electronic Assemblies