48 Products

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-7711/21B-TR: Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım

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J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

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J-STD-001F-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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IPC-A-610F-PL: Dopuszczalność Zespołów Elektronicznych

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IPC-7711/21B-IT: Rilavorazione, Modifica e Riparazione di Assemblati Elettronici

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J-STD-001F-IT: Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici

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IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

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J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-7526: Stencil and Misprinted Board Cleaning Handbook

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-1753: Laboratory Report Standard

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9706: Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and...

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IPC-4103A WAM1: Specification for Base Materials for High Speed/High Frequency Applications

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J-STD-030A: Selection and Application of Board Level Underfill Materials

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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J-STD-001F: J-STD-001 Revision E to Revision F Redline Comparison Document

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IPC-A-610F: IPC-A-610 Revision E to Revision F Redline Comparison Document

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices