40 Products

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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7351A-DE: SUPERSEDED BY 7351B-DE

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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IPC-A-610E-DE: Abnahmekriterien für elektronische Baugruppen

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IPC-CC-830B WAM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes...

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1