54 Products

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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A-620A-FR: Exigences et critères d’acceptation pour l’assemblage des câbles et faisceaux de câbles

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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1756: Manufacturing Process Data Management

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IPC-A-610E: Acceptability of Electronic Assemblies

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1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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TM-650-MDP: Method Development Packet

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1758: Declaration Requirements for Shipping, Pack and Packing Materials

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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J-STD-005A: Requirements for Soldering Pastes

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IPC/WHMA-A-620B: Superseded by IPC/WHMA-A-620C: IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

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IPC/JEDEC-9704A: Printed Circuit Assembly Strain Gage Test Guideline

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC/WHMA-A-620AS WAM1: Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A

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IPC-7527: Requirements for Solder Paste Printing