19 Products

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IPC-A-610DC-Telecom Addendum

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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Nonmember: $0.00

IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

Member: $67.00

Nonmember: $135.00

J-STD-075-DE: Classification of Non-IC Electronic Components for Assembly Processes

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Nonmember: $135.00

IPC-7525B-DE: Designrichtlinie für Druckschablonen

Member: $84.00

Nonmember: $168.00

IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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Nonmember: $168.00

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

Member: $84.00

Nonmember: $168.00

IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

Member: $84.00

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IPC/JEDEC-9703: IPC/JEDEC Mechanical Shock Test Guidelines for Solder Joint Reliability

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Nonmember: $168.00

IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

Member: $47.00

Nonmember: $93.00

IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

Member: $84.00

Nonmember: $168.00

IPC-9850A: Surface Mount Placement Equipment Characterization

Member: $47.00

Nonmember: $93.00

IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

Member: $58.00

Nonmember: $108.00

IPC-T-50J: SUPERSEDED BY T-50K

Member: $47.00

Nonmember: $93.00

IPC-7525B: Stencil Design Guidelines

Member: $84.00

Nonmember: $168.00

IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components