42 Products

Member: $84.00

Nonmember: $168.00

IPC-9850A: Surface Mount Placement Equipment Characterization

Member: $66.00

Nonmember: $131.00

IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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Nonmember: $93.00

IPC-7525B-CN: 模板设计指导

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Nonmember: $137.00

IPC-7525B-DE: Designrichtlinie für Druckschablonen

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IPC-7525B: Stencil Design Guidelines

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IPC-9202: Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

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IPC-T-50J: SUPERSEDED BY T-50K

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IPC-9709: Test Guidelines for Acoustic Emission Measurement during Mechanical Testing

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IPC/JEDEC-9707: Spherical Bend Test Method for Characterization of Board Level Interconnects

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JIG101ED4: Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

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IPC-CH-65B-CN: 印制板及组件清洗指南

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Nonmember: $168.00

IPC-CH-65B: Guidelines for Cleaning of Printed Boards and Assemblies

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IPC-7093-CN: 底部端子元器件(BTC)设计和组装工艺的实施

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IPC-7093: Design and Assembly Process Implementation for Bottom Termination Components

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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Nonmember: $93.00

IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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Nonmember: $168.00

IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-J-STD-001ES: Space Applications Electronic Hardware Addendum to IPC J-STD-001E Requirements for Soldered Electrical and Electronic...

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IPC-1601-CN: 印制板操作和贮存指南

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Nonmember: $137.00

IPC-1601-DE: Handhabung und Lagerung von Leiterplatten