96 Products

Member: $100.00

Nonmember: $200.00

IPC-A-610G: Acceptability of Electronic Assemblies

Member: $84.00

Nonmember: $168.00

J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

Member: $221.00

Nonmember: $441.00

IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

Member: $289.00

Nonmember: $565.00

IPC-4550-FAM: Plating Specifications

Member: $362.00

Nonmember: $682.00

IPC-6010-FAM: Printed Board Performance Specifications

Member: $284.00

Nonmember: $560.00

7090-FAM: Packages for PCBs and Assemblies

Member: $221.00

Nonmember: $441.00

CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

Member: $267.00

Nonmember: $533.00

PtdEleFAM: Printed Electronics Family

Member: $298.00

Nonmember: $568.00

SolMatFAM: Solder Materials Family

Member: $123.00

Nonmember: $246.00

IPC-A-610E-NL: Acceptatie van Geassembleerde Printplaten

Member: $47.00

Nonmember: $93.00

IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

Member: $47.00

Nonmember: $93.00

IPC/JEDEC-J-STD-020D-1-CN: IPC/JEDEC 非气密固态表面贴装器件潮湿/再流焊敏感度分级

Member: $84.00

Nonmember: $168.00

IPC-A-610E-CN: 电子组件的可接受性

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Nonmember: $168.00

J-STD-001E-CN: Rev E superseded by Rev F

Member: $67.00

Nonmember: $129.00

IPC-A-620B-S-CN: IPC/WHMA-A-620B航天应用电子部件补充标准

Member: $43.00

Nonmember: $86.00

IPC-1401-CN: 供应链社会责任管理体系指南

Member: $47.00

Nonmember: $93.00

IPC-1601-CN: 印制板操作和贮存指南

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Nonmember: $93.00

IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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Nonmember: $0.00

1756: Manufacturing Process Data Management

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Nonmember: $168.00

IPC-A-610E: Acceptability of Electronic Assemblies

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Nonmember: $0.00

1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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Nonmember: $168.00

J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

Member: $47.00

Nonmember: $93.00

IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

Member: $84.00

Nonmember: $168.00

IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation