IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English
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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline
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IPC-J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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IPC-A-610G: Acceptability of Electronic Assemblies - Multi Device License
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IPC-A-610G: Acceptability of Electronic Assemblies
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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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IPC-A-610G: Acceptability of Electronic Assemblies
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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies
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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC-J-STD-001G: ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์
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IPC-J-STD-001G: ข้อกำหนดสำหรับการบัดกรีอิเล็กทรอนิกส์และงานประกอบอิเล็กทรอนิกส์
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IPC-A-610G: การยอมรับของงานประกอบอิเล็กทรอนิกส์
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IPC-A-610G: การยอมรับของงานประกอบอิเล็กทรอนิกส์
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IPC-A-610G: Godkendelseskrav for elektronikprodukter
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IPC-A-610G:Godkendelseskrav for elektronikprodukter
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IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter
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IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter
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IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards
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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English