444 Products

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IPC-J-STD-001GS: Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001G Anforderungen an gelötete elektrische und...

Member: $45.00

Nonmember: $88.00

IPC-J-STD-001G-AM1: Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen.

Member: $15.00

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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-J-STD-001G-AM1: Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen.

Member: $155.00

Nonmember: $309.00

IPC-A-610G: Godkendelseskrav for elektronikprodukter

Member: $147.00

Nonmember: $294.00

IPC-A-610G:Godkendelseskrav for elektronikprodukter

Member: $130.00

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IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter

Member: $124.00

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IPC-J-STD-001G: Krav til loddede elektriske og elektroniske produkter

Member: $130.00

Nonmember: $259.00

IPC-J-STD-001G: Anforderungen an gelötete elektrische und elektronische Baugruppen

Member: $124.00

Nonmember: $247.00

IPC-J-STD-001G: Anforderungen an gelötete elektrische und elektronische Baugruppen

Member: $155.00

Nonmember: $309.00

IPC-A-610G: Abnahmekriterien für elektronische Baugruppen

Member: $147.00

Nonmember: $294.00

IPC-A-610G: Abnahmekriterien für elektronische Baugruppen

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Nonmember: $25.00

IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards

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IPC-9505: Guideline Methodology for Assessing Component and Cleaning Materials Compatibility

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

Member: $88.00

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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IPC-6013D:Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-7711/21C REDLINE: Rework, Modification and Repair of Electronic Assemblies - Redline

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes