356 Products

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IPC-7711/21C: Rework, modificatie en repair van elektronische assemblages - Chapter 1

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IPC-9111: Troubleshooting for Printed Board Assembly Processes

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IPC-9111:Troubleshooting for Printed Board Assembly Processes

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IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-A610G: Acceptatie van geassembleerde printplaten

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IPC-A-610G: Acceptatie van geassembleerde printplaten

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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten

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IPC-J-STD-001G: Eisen voor gesoldeerde elektrische en elektronische geassembleerde printplaten

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC-A-620C-NL: Eisen en acceptatie van kabel en draadboom assemblage

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IPC/WHMA-A-620C: Eisen en acceptatie van kabel en draadboom assemblages

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC-7095D: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

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IPC/JEDEC-9707-AM1: Spherical Bend Test Method for Characterization of Board Level Interconnects

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IPC-CC-830B-AM1: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies

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IPC/WHMA-A-620 Test Data Tables

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IPC/WHMA-A-620B-Redline