IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1
IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
IPC-J-STD-001G-AM1: J-STD-001G-AM1-FR / Les exigences relatives au brasage d’assemblages électroniques et électriques.
IPC-9111: Troubleshooting for Printed Board Assembly Processes
IPC-9111:Troubleshooting for Printed Board Assembly Processes
IPC-CC-830C: Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability
IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards